发明名称 Semiconductor device having a stress layer for applying tensile of compressive stress to the ferroelectric film
摘要 A semiconductor device comprises a substrate, a ferroelectric capacitor which includes a ferroelectric film on the substrate, and a stress application layer which applies tensile or compressive stress to the ferroelectric film of the ferroelectric capacitor by applying stress to the substrate.
申请公布号 US7075135(B2) 申请公布日期 2006.07.11
申请号 US20030716878 申请日期 2003.11.20
申请人 发明人
分类号 H01L21/66;H01L27/108;H01L21/00;H01L21/02;H01L21/8246;H01L27/105;H01L27/115;H01L29/76;H01L29/94;H01L31/119 主分类号 H01L21/66
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