| 摘要 |
FIELD: electronic engineering, in particular, method for manufacturing a multi-layer module of electronic board with high element positioning density. ^ SUBSTANCE: method includes preparation of two-sided substrate 1 with circuit boards 3, which is connected to additional polyimide layer 6 with one-layer cover 7 by metal, with utilization of polymerized two-phased epoxide liquid 8; after selective etching 9 of metal, anisotropic chemical forming of micro-apertures 12 is performed try polyimide film 6, by dipping the latter into static tub of water solution of ethylene diamine with addition of potassium at a temperature of at least 25°C. Gluing material 8 is washed by spraying a solvent in base of micro-apertures 12, then metallization of aforementioned micro-apertures 12 is performed and selective etching of external metallic film 7,13 for forming of a circuit board 14 on it, including micro-apertures 15 with metal covering. ^ EFFECT: decreased costs of production of modules, expanded technical capabilities. ^ 8 cl, 10 dwg |
