发明名称 PLATING DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a plating treatment device where, in the conventional jet type plating device, the stagnation in the flowing of a plating liquid in each microcorner part formed between the face to be plated in an object for plating and the inner circumferential face in each mounting part can be solved. SOLUTION: In the plating device where each annular mounting stand provided so as to project from the inner wall face of a plating tank to the inside at the upper opening edge of the plating tank, each mounting part with seal packing arranged at the upper part of the annular mounting stand, each liquid feed tube provided at the bottom part of the plating tank, and each liquid flow out port provided at the lower position of the mounting part are equipped, a plating liquid fed from the liquid feed tube at a rising stream is allowed to form a flow flowing out from the liquid flow out port to the outside of the plating tank, and the whole of the face to be plated in an object for plating is brought into contact with the plating liquid, so as to perform plating treatment, each mounting part is provided with liquid exhaust holes for exhausting the plating liquid stagnating at each microcorner part formed between the face to be plated in the object for plating and the inner circumferential face of the mounting part to the outside. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006176820(A) 申请公布日期 2006.07.06
申请号 JP20040370452 申请日期 2004.12.22
申请人 ELECTROPLATING ENG OF JAPAN CO 发明人 UCHIUMI YUJI
分类号 C25D7/12;C25D5/08;C25D17/08 主分类号 C25D7/12
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