| 摘要 |
A method for manufacturing a semiconductor device, wherein a lead frame (1) where the ends of inner leads (1d) are bonded to a heat spreader (1b) through an insulating thermoplastic adhesive (1c) is prepared and placed on a heat stage (6), and a semiconductor chip (2) is placed on the heat spreader (1b) and then bonded to the heat spreader (1b) through the heated and softened thermoplastic adhesive (1c). While pressing the ends of the inner leads (1d) toward the heat stage (6), the semiconductor chip (2) and the thermoplastic adhesive (1c) are bonded, and therefore die-bonding is carried out without disordering the inner leads (1d), thereby enhancing the assemblability of a semiconductor device. |
