| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device capable of joining two or more semiconductor substrates to one tape substrate without changing a tape bump material and an electrode pad material. <P>SOLUTION: The height of a bump 3 is formed beforehand in a different height corresponding to the tape bump connection height of a first semiconductor and a second semiconductor. In this way, without changing the tape bump material and the electrode pad material, it becomes possible to provide a semiconductor device capable of joining two or more semiconductor substrates to one tape substrate. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
