| 摘要 |
<P>PROBLEM TO BE SOLVED: To improve thermal fatigue life and moisture resistance of a solder connection part of a resin sealing semiconductor power module. <P>SOLUTION: In the semiconductor power module, a silicon chip and a connection conductor, which are soldered to a ceramic insulating substrate or a resin insulating metal substrate through a thermal diffusion board, are precoated with polyimide resin superior in heat resistance and moisture resistance. Precoat resin is coated and sealed with epoxy resin of a coefficient of linear expansion, which is adjusted to that of solder with a low Young's modulus. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
