LEAD FRAME, SEMICONDUCTOR PACKAGE EMPLOYING THE LEAD FRAME AND METHOD FOR MANUFACTURING THE SEMICONDUCTOR PACKAGE

摘要

Provided are a lead frame that can increase a heat dissipation performance by forming heat dissipation path in various direction, and a semiconductor package including the lead frame. The lead frame includes: a chip bonding pad on which a semiconductor chip can be mounted; at least one lead disposed adjacent to the chip bonding pad, and electrically insulated from the chip bonding pad by an insulating recess; a heat dissipation extension pad formed around the chip bonding pad while not contacting the lead, and distinguished from the chip bonding pad by a distinguishing recess; and a plurality of pad connection portions formed in the distinguishing recess to connect the chip bonding pad to the heat dissipation extension pad.