| 摘要 |
The invention provides a flip chip package structure. The flip chip package structure includes a substrate, a flip chip, a plurality of bumps, a first sealing material, and a second sealing material. The substrate has an upper surface and a plurality of pads formed on the upper surface. The flip chip has an active surface. Each of the bumps corresponds to one of the pads of the substrate, and the active surface of the flip chip is electrically connected and is attached to the upper surface of the substrate by the bumps. The first sealing material is coated between the flip chip and the substrate so as to fix the flip chip on the substrate. The second sealing material is coated to cover the first sealing material.
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