| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an LED array package structure that largely improves production efficiency and yield and a manufacturing method of the same. <P>SOLUTION: A trench structure is formed in the substrate 300. A light emitting diode array 302 and a driver integrated circuit 304 are installed in a corresponding trench. Further, an insulating layer 312 is formed on the substrate 300, light emitting diode 302, and driver integrated circuit 304. In addition, an electrically connected structure is formed between the light emitting diode 302 and the driver integrated circuit 304 in a photographic process. Next, individual units are cut off in a punching process. Further, these units are fixed on a printed circuit board, and these units and input/output pins are electrically connected on the printed circuit board. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
