发明名称 Flip-chip-Zusammenbau eines optischen Moduls und Ausrichtung mit Hilfe von Nuten und Glasfasern
摘要 An optical module having an optical element mounting substrate (2) and a package (4) with high precision is provided. A positioning groove (9) is formed in the mounting surface of the mounting substrate (2) on which an optical element (1) is mounted, and a package side positioning groove (5) is formed in the package (4) on which the mounting substrate is arranged. The optical element mounting substrate and the package are overlapped with each other with the substrate side positioning groove portion and the package side positioning groove portion facing each other. An optical fiber (3) that is a positioning member is inserted between the positioning groove portions. Thus, the optical element mounting substrate and the package are aligned. <IMAGE>
申请公布号 DE60028330(D1) 申请公布日期 2006.07.06
申请号 DE2000628330 申请日期 2000.12.21
申请人 THE FURUKAWA ELECTRIC CO., LTD. 发明人 MORI;IWASE
分类号 G02B6/42 主分类号 G02B6/42
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