发明名称 MANUFACTURING METHOD OF NITRIDE SEMICONDUCTOR SUBSTRATE, AND MANUFACTURING METHOD OF NITRIDE SEMICONDUCTOR DEVICE
摘要 <P>PROBLEM TO BE SOLVED: To provide the manufacturing method of a nitride semiconductor substrate capable of stably separating the substrate by performing efficiently the thermal decomposition of the nitride semiconductor by means of optical irradiation, and to provide a manufacturing method of a nitride semiconductor device. <P>SOLUTION: On a sapphire substrate 101, there are provided with a GaN buffer layer, a GaN layer 102, a multilayer 103 laminated alternately with an Al<SB>0.15</SB>Ga<SB>0.85</SB>N layer and a GaN layer, and furthermore a GaN layer 104 formed on the multilayer 103. By scanning a laser beam ranging from the side of the sapphire substrate 101 to the whole surface, the GaN layer 102 is decomposed so as to obtain a self-supporting substrate 105, and besides a GaN substrate 106 is obtained by grinding until the surface of the GaN layer 104 exposes the multilayer 103. <P>COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006179623(A) 申请公布日期 2006.07.06
申请号 JP20040370303 申请日期 2004.12.22
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 OGAWA MASAHIRO
分类号 H01L21/205;C23C16/01;C23C16/34;C30B29/38;H01L33/12;H01L33/32 主分类号 H01L21/205
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