BONDING WIRE AND INTEGRATED CIRCUIT DEVICE USING THE SAME

摘要

A bonding wire comprising a core and a coating layer formed on the core, wherein the coating layer is formed from a metal having a higher melting point than the core, and further has at least one of the following characteristics; 1. the wet contact angle with the coating layer when the core is melted is not smaller than 20 degrees; 2. when the bonding wire is hung down with its end touching a horizontal surface, and is cut at a point 15 cm above the end and thus let drop onto the horizontal surface, the curvature radius of the formed arc is 35 mm or larger; 3. the 0.2% yield strength is not smaller than 0.115 mN/µm 2 but not greater than 0.165 mN/µm 2 ; or 4. the Vickers hardness of the coating layer is 300 or lower.