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发明名称	STACKED CHIP PACKAGE
摘要
申请公布号	KR20060076456(A)	申请公布日期	2006.07.04
申请号	KR20040114873	申请日期	2004.12.29
申请人	HYNIX SEMICONDUCTOR INC.	发明人	JOH, CHEOL HO
分类号	H01L23/12;H01L31/10	主分类号	H01L23/12
代理机构		代理人
主权项
地址

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