METHOD OF POLISHING A SILICON WAFER USING A POLISHING COMPOSITION AND A SURFACE TREATING COMPOSITION

摘要

A POLISHING COMPOSITION FOR SILICON WAFERS HAVING A RESISTIVITY OF AT MOST 0.1 Ω . CM, COMPRISING WATER, AN ABRASIVE AND, AS AN ADDITIVE, AT LEAST ONE COMPOUND SELECTED FROM THE GROUP CONSISTING OF AN ALKALI METAL HYDROXIDE, AN ALKALI METAL CARBONATE, AN ALKALI METAL HYDROGENCARBONATE, A GUATERNARY AMMONIUM SALT, A PEROXIDE AND A PEROXO ACID COMPOUND.