| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device for relaxing a stress concentrated on the edge section of a semiconductor chip, and for improving the adhesiveness of sealing resin and the semiconductor chip. <P>SOLUTION: In the semiconductor device, a semiconductor chip 4 is mounted on the upper face of a wiring board 3, and the upper face of the wiring board 3 containing the semiconductor chip 4 is sealed by sealing resin 6. The device is configured so that a groove 7 faced to the edge of the semiconductor chip 4 can be formed on the upper face of the wiring board 3. Thus, a portion of the back face of the semiconductor chip 4 is sealed by the sealing resin 6, and the adhesive area of the sealing resin 6 and the wiring board 3 is increased so that the adhesiveness of the sealing resin 6 can be improved. Also, the stress concentration of the lower edge section of the semiconductor chip 4 can be reduced on the upper face of the wiring board 3, and the improvement of stress resistivity can be realized. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
