| 摘要 |
PROBLEM TO BE SOLVED: To provide metallic material for a printed-circuit board where the surface of a heat resistant copper alloy foil is smooth and the surface of Ni plating has satisfactory wettability. SOLUTION: In the metallic material for the printed-circuit board, at least one surface of a rolled copper alloy foil is finished to be a bright surface, the surface is Ni or Ni alloy plated with≥0.3μm thickness, and the contact angle of water on the surface is≤80°, desirably≤40°. After the Ni plating or Ni alloy plating, silane coupling treatment or titanium coupling treatment is carried out, and corona discharge, plasma treatment or UV ozonization is carried out to obtain the satisfactory wettability. COPYRIGHT: (C)2006,JPO&NCIPI
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