发明名称 DEVICE AND METHOD FOR MOUNTING CHIP
摘要 PROBLEM TO BE SOLVED: To provide a device and method for mounting chip by which various kinds of chips having different sizes can be picked up stably. SOLUTION: In the chip mounting device which picks up a chip 6 stuck to a sheet 5 with an adhesive layer 5a which generates a nitrogen gas when the layer 5a is irradiated with ultraviolet rays from the sheet 5 and mounts the picked-up chip 6 on a substrate, a shutter section constituted by laminating two light shielding plates 37 and 38 upon another is provided between a UV light source section 8b and the sheet 5 where the chip is stuck. The light transmitting sections 37b and 38b of the light shielding plates 37 and 38 can freely change a laminated light transmitting range T, and the light transmitting range T through which the light irradiated upon the sheet 5 is transmitted is changed in accordance with the shape/size of the chip 6 before the light is irradiated. Consequently, the chip mounting device can mount various kinds of chips having different sizes on the substrate by irradiating the range corresponding to the chip to be picked up with light. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006173362(A) 申请公布日期 2006.06.29
申请号 JP20040363888 申请日期 2004.12.16
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 HAJI HIROSHI;OSONO MITSURU;KASAI TERUAKI
分类号 H01L21/52 主分类号 H01L21/52
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