摘要 |
PROBLEM TO BE SOLVED: To provide a device and method for mounting chip by which various kinds of chips having different sizes can be picked up stably. SOLUTION: In the chip mounting device which picks up a chip 6 stuck to a sheet 5 with an adhesive layer 5a which generates a nitrogen gas when the layer 5a is irradiated with ultraviolet rays from the sheet 5 and mounts the picked-up chip 6 on a substrate, a shutter section constituted by laminating two light shielding plates 37 and 38 upon another is provided between a UV light source section 8b and the sheet 5 where the chip is stuck. The light transmitting sections 37b and 38b of the light shielding plates 37 and 38 can freely change a laminated light transmitting range T, and the light transmitting range T through which the light irradiated upon the sheet 5 is transmitted is changed in accordance with the shape/size of the chip 6 before the light is irradiated. Consequently, the chip mounting device can mount various kinds of chips having different sizes on the substrate by irradiating the range corresponding to the chip to be picked up with light. COPYRIGHT: (C)2006,JPO&NCIPI
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