| 摘要 |
PROBLEM TO BE SOLVED: To provide a manufacturing method with which dispersion and stability of metal particles in paint are improved and a circuit can be formed with circuit substance that is sufficiently low even in low-temperature curing. SOLUTION: In the method of manufacturing a substrate with a circuit, the substrate is coated with circuit formation paint which contains metal particles, polycarboxylic acid compound, and organic solvent of which a boiling point is 200°C or lower and of which the ratio (W<SB>S</SB>)/(W<SB>M</SB>) of the weight (W<SB>S</SB>) of the polycarboxylic acid compound and the weight (W<SB>M</SB>) of the metal particles is settled within the range of 0.001 to 0.2, and then heating the substrate at a temperature of <200°C, thereby forming the circuit. COPYRIGHT: (C)2006,JPO&NCIPI
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