| 摘要 |
PROBLEM TO BE SOLVED: To provide a method which does not receive the influence of the minute particles remaining on a mask while being capable of certainly filling up the pattern of the mask with the minute particles, such as a solder ball. SOLUTION: A ball mounter 1 performs a step S8 for moving a lot of solder balls by a head for filling, and a step S9 for removing the solder balls remaining in the mask by the head for removal. In the step S8, since remaining balls may be generated, sufficient quantity of solder balls can be moved. Further, in the step S9, remaining balls are removed, and the solder balls with which the opening pattern of the mask is filled up can be pressed and closely attached to flux. COPYRIGHT: (C)2006,JPO&NCIPI
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