| 摘要 |
A chip socket with one or more seals protecting the contact members. The seals are formed in a multi-step molding process. In a first step, an insulative housing is formed with grooves in the surface. In the second step, a seal material is molded into the grooves with a portion extending above the surface of the insulative housing. In use, surfaces of the chip socket are pressed against a semiconductor chip or a circuit board. When pressed together, the components of the connector system form seals that protect contact members from environmental conditions. The seals allow reliable electrical connections to be made with reduced force per contact. Greater flexibility in designing the contact members is therefore provided contact members having a low spring force and a relatively large deflection range, thereby accommodating a less stringent coplanarity requirement for the chip and circuit board.
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