发明名称 LED LEAD FRAME AND METAL DIE FOR INJECTION MOLDING USED FOR MANUFACTURING THE SAME
摘要 <P>PROBLEM TO BE SOLVED: To provide an LED lead frame which does not easily generate crack at a body and peeling between the body and the lead frame. <P>SOLUTION: In the LED lead frame to form a resin body with the insertion molding process, the LED lead frame completes the bending process of a metal lead before the relevant insertion molding process. <P>COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006173155(A) 申请公布日期 2006.06.29
申请号 JP20040359368 申请日期 2004.12.13
申请人 ENOMOTO CO LTD 发明人 OGAWA HIDEO;UMEYA KAZUYOSHI
分类号 H01L33/62 主分类号 H01L33/62
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