发明名称 |
Processing a memory link with a set of at least two laser pulses |
摘要 |
A set ( 50 ) of laser pulses ( 52 ) is employed to sever a conductive link ( 22 ) in a memory or other IC chip. The duration of the set ( 50 ) is preferably shorter than 1,000 ns; and the pulse width of each laser pulse ( 52 ) within the set ( 50 ) is preferably within a range of about 0.1 ps to 30 ns. The set ( 50 ) can be treated as a single "pulse" by conventional laser positioning systems ( 62 ) to perform on-the-fly link removal without stopping whenever the laser system ( 60 ) fires a set ( 50 ) of laser pulses ( 52 ) at each link ( 22 ). Conventional IR wavelengths or their harmonics can be employed.
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申请公布号 |
US2006138109(A1) |
申请公布日期 |
2006.06.29 |
申请号 |
US20060360962 |
申请日期 |
2006.02.22 |
申请人 |
SUN YUNLONG;SWENSON EDWARD J;HARRIS RICHARD S |
发明人 |
SUN YUNLONG;SWENSON EDWARD J.;HARRIS RICHARD S. |
分类号 |
B23K26/16;B23K26/04;B23K26/06;B23K26/067;H01L21/768;H01L23/525;H01S3/00 |
主分类号 |
B23K26/16 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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