发明名称 PROCESSOR MODULE WITH HEAT DISSIPATION DEVICE
摘要 PROBLEM TO BE SOLVED: To provide an electronic module that can fully radiate using its internal heating device, and its heat dissipation method. SOLUTION: The electronic module (190, 192) that can be connected with and disconnected from a system board (102) is equipped with a primary part (192) connected with the foregoing system board and secondary part (190) connected to the top of the primary part. The primary part (192) includes a heat dissipation device (120A) and printed circuit board (PCB) (104), and the primary side (168) of the PCB is connected with a processor (110), while the heat dissipation device (120A) extends between the processor (110) and the system board (102). The foregoing secondary part (190) has a power system board (130) that supplies power to the foregoing processor, and the power system board is located adjacent to the secondary side of the PCB (104) extending in parallel with the secondary side. The above-mentioned are the main features of this invention. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006173603(A) 申请公布日期 2006.06.29
申请号 JP20050353126 申请日期 2005.12.07
申请人 HEWLETT-PACKARD DEVELOPMENT CO LP 发明人 BELADY CHRISTIAN L;WILLIAMS GARY W;HARRIS SHAUN L;BELSON STEVEN A;PETERSON ERIC C
分类号 H01L23/36;H01L23/427;H01L23/473;H01L25/04;H01L25/18 主分类号 H01L23/36
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