| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device in which the test of a built-in RAM can be carried out with reduced number of external terminals, a defective point can be simply specified, and connection of an input/output terminal of the outside terminal and a memory part can be switched on the basis of package information. SOLUTION: When the input/output of the RAM is connected to the external terminal of a semiconductor device, flip-flops constituting first and second latch circuits 110, 111 are provided between the external terminal and the address terminal 115 and a data input terminal 116 of an SRAM 101. Since an address/data external terminal 107 can be shared by the address terminal 115 and the data input terminal 116 by latching data by the first and second latch circuits 110, 111 so that test vector can be inputted simultaneously to the SRAM 101, inspection of the RAM can be carried out even when the number of external terminals are reduced. COPYRIGHT: (C)2006,JPO&NCIPI
|
