发明名称 |
STECKVERBINDERANORDNUNG MIT HOHER PACKUNGSDICHT FÜR EIN LEITERPLATTEMODUL |
摘要 |
A circuit board module includes a plurality of high density edge connectors in which the contacts are arranged in rows, with contact tails extending from the connectors for electrical connection to a circuit board carrying electrical components. Instead of terminating the contacts directly to pads or terminals on the principal surface of the circuit board on which the electrical components are situated, however, the contact tails are terminated to pads or terminals on pairs of intermediate circuit boards connected to the main boards, the intermediate circuit boards each providing two termination surfaces rather than one, thereby effectively doubling the space available for termination. The intermediate circuit boards are connected to the main circuit board by a rigid-flex interconnection, thus facilitating assembly of the connectors to a heatsink or frame of the circuit board following termination of the contact tails to the intermediate circuit boards. |
申请公布号 |
DE69834606(D1) |
申请公布日期 |
2006.06.29 |
申请号 |
DE1998634606 |
申请日期 |
1998.01.13 |
申请人 |
AMPHENOL CORP., WALLINGFORD |
发明人 |
CHAPMAN, KENNETH;SELFRIDGE, ALLEN |
分类号 |
H01R12/50;H01R12/52;H01R12/62;H01R12/72;H01R13/631;H05K1/11;H05K1/14 |
主分类号 |
H01R12/50 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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