<p>An apparatus for dispensing fluid during semiconductor substrate processing operations. The apparatus includes a central fluid dispense bank comprising a plurality of dispense nozzles coupled to a plurality of fluid sources and a first processing chamber positioned to a first side of the central fluid dispense bank. The apparatus also includes a second processing chamber positioned to a second side of the central fluid dispense bank and a dispense arm adapted to translate between the central fluid dispense bank, the first processing chamber, and the second processing chamber.</p>
申请公布号
WO2006069348(A2)
申请公布日期
2006.06.29
申请号
WO2005US46906
申请日期
2005.12.21
申请人
APPLIED MATERIALS, INC.;ISHIKAWA, TETSUYA;ROBERTS, RICK, J.