发明名称 THIN-FILM FORMING METHOD, THIN-FILM DEVICE, AND ELECTRONIC APPARATUS
摘要 PROBLEM TO BE SOLVED: To provide a technology enabling satisfactory film forming with the use of a liquid process, regardless of the relation between properties of a film-forming face and those of a fluid material. SOLUTION: A method of forming a film, using a fluid material containing a solute to be a thin film and a solvent to dissolve it, includes a first process of raising temperature of at least the vicinity of a film-forming face of an object (10) to be higher than the boiling point of the fluid material (12); a second process of dropping the fluid material on the film-forming face of the object; and a third process of raising temperature of the fluid material up to the boiling point at the time, when the fluid material reaches the film-forming face of the object, and making the solvent evaporate. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006172987(A) 申请公布日期 2006.06.29
申请号 JP20040365918 申请日期 2004.12.17
申请人 SEIKO EPSON CORP 发明人 MAKIURA RIE;GOHARA MASAYOSHI
分类号 H05B33/10;H01L51/50 主分类号 H05B33/10
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