发明名称 SUBSTRATE RETAINING DEVICE, SUBSTRATE RETAINING METHOD AND SUBSTRATE HEATING DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a substrate retaining device and a substrate retaining method capable of attracting and retaining favorably the substrate with warpage generated therein to a retaining plate in a substantially flat state, and a substrate heating device capable of effecting favorably the heating treatment of a resist or the like applied on the substrate. SOLUTION: The substrate heating device is provided with a retaining table 21 for retaining the substrate 1, a heating means for heating the retaining table 21, and an attracting means for attracting the substrate 1 onto the retaining table 21. When the substrate 1 with warpage generated therein is disposed on the retaining table 21 heated by the heating means, the attracting means 28 attracts and retains a plurality of regions of the substrate 1 in different timing respectively in accordance with the reducing amount of the warpage of the substrate 1 caused by the heat of the retaining table 21. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006173344(A) 申请公布日期 2006.06.29
申请号 JP20040363472 申请日期 2004.12.15
申请人 SEIKO EPSON CORP 发明人 MOMOSE SHINYA
分类号 H01L21/683;H01L21/027 主分类号 H01L21/683
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