发明名称 |
Flip-chip type quad flat package and leadframe |
摘要 |
A flip-chip type quad flat package and a leadframe. The leadframe comprises a bump-connecting area and a non-connecting area. The maximum width of the bump-connecting area is larger than the width of the non-connecting area. A bump is limited to the bump-connecting area after performing a reflow process so that the bumps are prevented from collapsing, the manufacturing cost is reduced and the process is simplified.
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申请公布号 |
US7067904(B2) |
申请公布日期 |
2006.06.27 |
申请号 |
US20040979881 |
申请日期 |
2004.11.01 |
申请人 |
ADVANCED SEMICONDUCTOR ENGINEERING, INC. |
发明人 |
WANG HSUEH-TE;WANG MENG-JEN;CHIU CHI-HAO;LIU CHIEN |
分类号 |
H01L23/495;H01L23/31;H01L23/48 |
主分类号 |
H01L23/495 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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