发明名称 Hot melt adhesive composition based on a random copolymer of isotactic polypropylene
摘要 A hot melt adhesive composition is based on an isotactic polypropylene random copolymer (RCP). The composition contains about 4%-50% by weight of the RCP copolymer, about 20%-65% by weight of a compatible tackifier, about 0%-40% by weight of a plasticizer, about 0%-3% by weight of a stabilizer, about 0%-40% by weight of a wax, and optionally about 0%-60% by weight of an atactic poly-alpha-olefin (APAO). The adhesive composition may be used in a number of applications such as, for example, in disposable nonwoven hygienic articles, paper converting, flexible packaging, wood working, carton and case sealing, labeling and other assembly applications.
申请公布号 US7067585(B2) 申请公布日期 2006.06.27
申请号 US20020282168 申请日期 2002.10.28
申请人 BOSTIK, INC. 发明人 WANG BAOYU;KANDERSKI MONINA DADAP;SVENNINGSEN LACRETIA A.;STRELOW DIANE M.;ZHANG CHONGYAO;GIBES MARK A.
分类号 C08F8/00;B29C47/00;C08L23/00;C08L23/04;C08L23/14;C08L25/02;C09D11/02;C09J7/02;C09J123/14 主分类号 C08F8/00
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