发明名称 |
Package having bond-sealed underbump |
摘要 |
A package for containing microelectromechanical devices includes a first substrate wafer, and a second substrate wafer made of an optical quality material. An underbump is interposed between the first and second substrate wafers. The underbump is composed of a standoff region and a localized bond region. The first and second substrate wafers and the underbump define a chamber that contains at least one microelectronic device.
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申请公布号 |
US7067355(B2) |
申请公布日期 |
2006.06.27 |
申请号 |
US20040854110 |
申请日期 |
2004.05.26 |
申请人 |
HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P. |
发明人 |
HALUZAK CHARLES C.;TRUNINGER MARTHA A.;MICHAEL DONALD L. |
分类号 |
H01L21/50;H01L21/44;H01L21/48;H01L23/02 |
主分类号 |
H01L21/50 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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