发明名称 PERMANENT ARRANGING METHOD OF LOW THERMAL EXPANSION LINEAR BODY
摘要 PROBLEM TO BE SOLVED: To provide a permanent arranging method of a low thermal expansion linear body capable of concurrently performing manufacture and mounting operation and eliminating the effect of transportation and mounting on the low thermal expansion linear body. SOLUTION: On the permanent arranging method of a low thermal expansion linear body, a conductive linear body 21 having positive thermal expansion coefficient, on which a groove 22 is formed, is prepared, and a complex linear body 31 semi-compounded with a linear body 23 having negative or low thermal expansion coefficient is temporarily arranged on an intended position of the groove 22. The low thermal expansion linear body is permanently arranged by heating and curing the complex linear body 31 in a state of temporal arrangement of the complex linear body 31. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006164692(A) 申请公布日期 2006.06.22
申请号 JP20040352973 申请日期 2004.12.06
申请人 RAILWAY TECHNICAL RES INST 发明人 KAMIJIYOU HIROTAKA
分类号 H01B13/00;B60M1/13;B60M1/28;H01B5/02 主分类号 H01B13/00
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