FLUID DISCHARGE NOZZLE AND SUBSTRATE TREATMENT APPARATUS USING THE SAME

摘要

PROBLEM TO BE SOLVED: To provide a fluid discharge nozzle which can supply fluid to a substrate while suppressing damage and a substrate treatment apparatus capable of suppressing readhesion of contaminants to the substrate by using the fluid discharge nozzle.

SOLUTION: The gas and liquid entered from a gas inflow port 2 and a liquid inflow port 3 are mixed in a mixing section 4 and the mixture is injected from a jet orifice 6 provided at the end of a lead-out path 5 toward a semiconductor wafer 7. A curved section 8 is provided extending in the longitudinal direction of the of the lead-out path 5 from the jet orifice 6. The curved section 8 has a shape curved variously in a direction parting from a central axis 12 of the lead-out path 5. The lead-out path 5 can have a section of a rectangular shape in the longitudinal direction.

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