| 摘要 |
PROBLEM TO BE SOLVED: To provide an apparatus for mounting an electronic component and an inspection method for adhesion of a bond capable of eliminating a shift in position of conveyance and transfer on each stage by making position adjustment for a substrate in advance to improve accuracy in positioning and productivity. SOLUTION: The apparatus for mounting an electronic component includes a first stage 10 for mounting a supplied substrate P, a sticking stage 15 where the bond S is stuck to the mounted substrate, a temporarily pressure-bonding stage 20 for temporarily pressure-bonding the electronic component H to the substrate via the bond, a pressure-bonding stage 30 for fully pressure-bonding the component to the substrate, a discharging stage 35 for taking out the substrate with the electronic component mounted to the outside, and first to fourth conveyance mechanisms 8A-8D provided between the adjacent stages for conveying the substrate between the two predetermined points. The first stage includes a position correction mechanism G for recognizing a recognition mark M put on the substrate and repositioning the substrate, so that each conveyance mechanism can transfer and receive the substrate to/from a predetermined reference position in each stage depending on the recognition results. COPYRIGHT: (C)2006,JPO&NCIPI
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