| 摘要 |
PROBLEM TO BE SOLVED: To provide a high temperature solder material having a suitable melting temperature for assembling an electronic component or the like, further free from the generation of voids after melting and solidifying, and having suitable joining stability. SOLUTION: The high temperature solder material is composed so as to have a composition containing, by mass, 12 to 16% Sb, 0.01 to 2% Ag, 0.1 to 1.5% Cu and trace amounts of Si and B as well, and the balance Sn with inevitable impurities to the whole thereof. Si and B have an action of familiarizing the respective metals to each other, and can prevent the flocculation between the same metals in the solder material after its melting and solidifying. As a result, the generation of voids in the solder material after the melting and solidifying can be prevented. Namely, the structure composing the high temperature solder is made dense, thus the joining stability of the high temperature solder material is improved. By using the high temperature solder material, the reliability of an electronic component is improved as well. COPYRIGHT: (C)2006,JPO&NCIPI
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