| 摘要 |
PROBLEM TO BE SOLVED: To provide a local soldering device capable of improving the through-hole rise of a molten solder, while being able to suppress the temperature rise of the top face of a work. SOLUTION: The local soldering device locally solders the work W with the lead L of a part A inserted therein, to the through-hole H of a substrate P. A local soldering nozzle 12 for a local soldering is arranged on the lower side of the work W. An inert-gas cover 13, supplied with an inert gas, such as a nitrogen gas, is arranged on the upper side of the work W in a freely advancing/retreating manner. The inert-gas cover 13 is mounted on the lower plate 23 of a positioning device 14 positioning the work W by a locating pin 24, and moved forward and retreated with repect to the work W, while being integrated with the locating pin 24. COPYRIGHT: (C)2006,JPO&NCIPI |
