发明名称 IMAGE PICKUP MODULE
摘要 <P>PROBLEM TO BE SOLVED: To prevent the generation of any failure due to the adhesion of dust stuck to parts or the like to the light receiving face of an image pickup element at the time of assembling an image pickup module or in a status that an image pickup module is mounted on a product. <P>SOLUTION: This image pickup module 10 is configured so that a substrate 30 loaded with an image pickup element 31 can be mounted on a casing part 20b configuring a holder 20 with a cylinder body part 20a for supporting a light receiving lens 21 by positioning the light receiving face of the image pickup element 31 to a light receiving lens 21. The holder 20 is provided with a partitioning wall 20c for separating a region where the image pickup element 31 is loaded on the substrate 30 from the outside region. <P>COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006165964(A) 申请公布日期 2006.06.22
申请号 JP20040353881 申请日期 2004.12.07
申请人 SHINKO ELECTRIC IND CO LTD 发明人 SHIRAISHI SATORU;KOJIMA TOMINARI
分类号 H01L27/14;H04N5/225;H04N5/335 主分类号 H01L27/14
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