| 摘要 |
PROBLEM TO BE SOLVED: To provide a technology that removes void absolutely and solders elements on a substrate without producing solder nets. SOLUTION: This soldering equipment has a desk for placing a substrate with elements laid by soldering, a means for heating and fusing solder, a means for tilting the desk, a means for recognizing a void contained in the fused solder and acquiring position information on the void, a means for calculating the void travel speed based on the acquired void position information, and a means for controlling the above means for tilting the desk. The control means determines a target tilt angle for the desk based on the calculated void travel speed, and controls the means for tilting the desk so that the desk can be slanted to a target tilt angle. COPYRIGHT: (C)2006,JPO&NCIPI |
