| 摘要 |
PROBLEM TO BE SOLVED: To accurately detect minute attachments adhering to hot plate. SOLUTION: In this attachment detecting method of thermal treatment board, a hot platen is divided to two or more regions. Integrated value of the temperature fluctuation is first collected in each region at the time of Wafer W being laid in the normal hot platen without attachment. Based on this integrated value at normal state, Mahalanobis' reference space is generated in discriminant analysis method (S3). At actual thermal treatment, integrated value of temperature fluctuation is next detected in each region when wafer W is laid on the hot platen. Based on the Mahalanobis' reference space generated beforehand, Metric of Mahalanobis about integrated value at the time of treatment is computed (S6). The computed Mahalanobis distance and the threshold are compared, and whether there is attachment adhering to the hot platen (S7) is determined. COPYRIGHT: (C)2006,JPO&NCIPI
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