| 发明名称 |
Flexible circuits and method of making same |
| 摘要 |
Disclosed is a method for making flexible circuits in which portions of a tie layer are removed by etching the underlying polymer. Also disclosed are flexible circuits made by this method.
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| 申请公布号 |
US2006134914(A1) |
申请公布日期 |
2006.06.22 |
| 申请号 |
US20050294828 |
申请日期 |
2005.12.06 |
| 申请人 |
3M INNOVATIVE PROPERTIES COMPANY |
发明人 |
DASARATHA SRIDHAR V.;MCHATTIE JAMES S.;SHIRCK JAMES R.;YAMAZAKI HIDEO;HIROSHIGE YUJI;SEKIGUCHI MAKOTO |
| 分类号 |
H01L21/302;H01L21/461 |
主分类号 |
H01L21/302 |
| 代理机构 |
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代理人 |
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| 主权项 |
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