method of forming passivation layer in semiconductor device,申请号KR20040057184-传众专利搜索

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发明名称	method of forming passivation layer in semiconductor device
摘要
申请公布号	KR100590397(B1)	申请公布日期	2006.06.19
申请号	KR20040057184	申请日期	2004.07.22
申请人		发明人
分类号	H01L21/31	主分类号	H01L21/31
代理机构		代理人
主权项
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