发明名称 |
Components, methods and assemblies for multi-chip packages |
摘要 |
An ultra thin system-in-a-package (SIP) with independent test and repair capability comprises an interposer having arranged on a top surface and a bottom surface thereof a number of packaged semiconductor chips mounted via solder bumps in accordance with a Land Grid Array (LGA) format and wherein no underfill is used on the SIP.
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申请公布号 |
US7061122(B2) |
申请公布日期 |
2006.06.13 |
申请号 |
US20030683097 |
申请日期 |
2003.10.10 |
申请人 |
TESSERA, INC. |
发明人 |
KIM YOUNG-GON;GIBSON DAVID;WARNER MICHAEL;DAMBERG PHILIP;OSBORN PHILIP |
分类号 |
H01L29/40;H01L25/10;H05K1/14;H05K3/34 |
主分类号 |
H01L29/40 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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