DISPOSITIF MICROELECTRONIQUE D'INTERCONNEXION A TIGES CONDUCTRICES LOCALISEES

摘要

Fabrication of conducting pins (310) endowed with one or more conductor contacts (302), each coming into contact with an electronic component contact, comprises: - (a) deposition of a masking layer on a component; - (b) formation of holes in the masking layer; - (c) filling these holes with a conducting material to form the conducting pins; - (d) removing the masking layer. - An INDEPENDENT CLAIM is also included for micro-electronic devices obtained by this method.