| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a thermoplastic resin applicable as various kinds of functional materials, having low elasticity and low stress and holding cohesive force and reliability even at high temperatures and having heat resistance or a precursor resin thereof. <P>SOLUTION: A thermoplastic resin having≤1 GPa modulus of elasticity at 25°C room temperature and≥1 MPa modulus of elasticity at 250°C or a precursor resin thereof is provided. <P>COPYRIGHT: (C)2006,JPO&NCIPI</p> |
