发明名称 MODULARIZATION RADIATOR
摘要 PROBLEM TO BE SOLVED: To provide a modularization radiator whose radiating efficiency is high. SOLUTION: This modularization radiator includes at least two radiating modules arrayed back and forth and at least one connecting pipe. Each radiating module includes a plurality of radiating fins, a plurality of heat exchanging pipes, two fixing plates, a plurality of first curved pipes and a plurality of second curved pipes. The plurality of first curved pipes are connected to first vertical outside two adjacent heat exchanging pipes, and the plurality of second curved pipes are connected to second vertical outside two adjacent heat exchanging pipes. The heat exchanging pipes are serially connected so that a continuous S-shaped conduct can be formed, and each S-shaped conduit includes an entrance and exit, and the connecting pipe is connected to the exit of the S-shaped pipe of one of the radiating modules and the entrance of the S-shaped conduit of the next radiating module. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006148047(A) 申请公布日期 2006.06.08
申请号 JP20050156741 申请日期 2005.05.30
申请人 FORWARD ELECTRONICS CO LTD 发明人 HUANG JUNG-FONG;WONG CHI-KIN
分类号 H01L23/473;F25D9/00;F25D17/02;F28D1/00;F28D1/047;F28F1/32;F28F9/26;G06F1/20;H05K7/20 主分类号 H01L23/473
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