| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a substrate for dust removal excellent in capability of dust removing from the inside of a substrate treating device such as a semiconductor device etc., as well as in such properties as conveyablity, vacuum attainment time, etc., and also to provide a new heat resistant resin that is suitably used for the substrate for dust removal and is usable even in a condition where a serious obstacle caused by pollution of silicone may happen in application to HDD or, in part, to the semiconductor etc. <P>SOLUTION: The substrate for dust removal in a substrate treating device has a substrate and, at least on one surface of the substrate, a cleaning layer comprised of a heat resistant resin whose storage modulus (1 Hz) in a range of 20-150°C is 5×10<SP>7</SP>to 1×10<SP>9</SP>Pa, and the resin is a polyimide resin that is suitable for a heat resistant resin for the cleaning layer and is usable even in a condition where a serious obstacle caused by pollution of silicone may happen in application to an HDD or, in part, to a semiconductor etc. <P>COPYRIGHT: (C)2006,JPO&NCIPI</p> |
