| 摘要 |
PROBLEM TO BE SOLVED: To provide a backing plate which prevents warp occurring upon bonding with a target material, reduces stress occurring upon film deposition (sputtering deposition) of Al-Nd alloy thin films, saves the flattening process of the warp, is reduced in cracking and peeling of a brazing filler metal arranged between the target material and the backing plate and thereby enables stable film deposition operation over a long period of time. SOLUTION: The backing plate for the sputtering targets is characterized in that the backing plate is composed of an aluminum alloy and that the Al alloy has an average coefficient of linear expansion of≤23.0x10<SP>-6</SP>/°C at 25 to 100°C. COPYRIGHT: (C)2006,JPO&NCIPI
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