发明名称 |
Apparatus and method for molding simultaneously a plurality of semiconductor devices |
摘要 |
Provided is a molding apparatus for molding simultaneously a plurality of semiconductor devices. The molding apparatus includes a mold, a plurality of plungers, and a plunger block. The mold is prepared to mold a plurality of semiconductor devices. The plurality of plungers are plunged into the mold to inject a molding compound that will encapsulate the semiconductor devices in the mold. The plurality of plungers are assembled with the plunge block to operate at the same time. Each of the plurality of plungers includes a load sensor and/or a contact sensor, so as to sense separately whether the plungers are improperly operating.
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申请公布号 |
US2006118982(A1) |
申请公布日期 |
2006.06.08 |
申请号 |
US20060341803 |
申请日期 |
2006.01.27 |
申请人 |
SAMSUNG ELECTRONICS CO. LTD. |
发明人 |
LEE SUNG-SOO;LEE DAE-SUNG;PARK KYUNG-SOO |
分类号 |
B29C45/14;B29C45/02;B29C45/76;B29L31/34;H01L21/56 |
主分类号 |
B29C45/14 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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