| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a mounting method of an electronic element in which a mounting structure of high connection reliability can be attained at a low cost by reducing mechanical stress in mounting the electronic element on a wiring board. <P>SOLUTION: An electronic element (semiconductor chip) is bonded onto a wiring board while directing the active surface to the surface side (die bond step). An inclining surface leading to the active surface of the electronic element from the surface of the wiring board is formed around the electronic element (slope forming step). Metal wiring for connecting the electrode terminal on the active surface and the wiring pattern on the wiring board is formed on the inclining surface by liquid drop ejection method (metal wiring formation step). Before the metal wiring is formed, an organic insulating film composed of epoxy resin, urethane resin, or the like, is formed on the active surface of the electronic element on which the metal wiring is formed thus enhancing adhesion. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
