发明名称 FLOORING
摘要 PROBLEM TO BE SOLVED: To provide flooring compatible with dimensional stability over a temperature variation and dimensional stability over a humidity variation. SOLUTION: A flooring consisting of a thermoplastic resin and an inorganic resin composite material formed of an inorganic filler dispersed into the thermoplastic resin, has 30 to 80 wt.% of a filling quantity of the inorganic filler in the inorganic resin composite material. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006144272(A) 申请公布日期 2006.06.08
申请号 JP20040332392 申请日期 2004.11.16
申请人 SEKISUI CHEM CO LTD 发明人 ICHIHARA KOJI;HAGINO TOMOKAZU
分类号 E04F15/10;C08J9/10;C08L101/00;D06N7/02 主分类号 E04F15/10
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